BERGQUIST GAP PAD TGP HC5000,GAP PAD HC 5.0

bergquist gap pad  tgp hc5000,formerly known as gappad  hc 5.0

highly conformable, thermally conductive, low-modulusmaterial

features and benefits

• thermal conductivity: 5.0 w/m-k

• high-compliance, low compression stress

• fiberglass reinforced for shear and

tear resistance

bergquist  gap pad  tgp hc5000 is a soft and compliantgap filling material with a thermal conductivity of 5.0 w/m-k.thematerial offers exceptional thermal  performance at lowpressures due to a unique filler package and low-modulusresin  formulation. the enhanced material is ideal forapplications re low stress on components and boards duringassembly.

bergquist  gap pad tgp hc5000 maintains a conformablenature that allows for excellent interfacing and wet-outcharacteristics, even to surfaces with high roughness and/ortopography.

bergquist  gap pad  tgp hc5000 is offered with naturalinherent tack on both sides of the material, eliminating the needfor thermally-impeding adhesive layers.

the top side has minimal tack for ease ofuist  gap pad  tgp hc5000 is supplied withprotective liners on both sides. 

bergquist gphc5.0typical applications include:

• telecommunications

• asics and dsps

• consumer electronics

• thermal modules to heat sinks

configurations available:

• sheet form and die-cut parts