BERGQUIST GAP PAD TGP 5000,GAP PAD 5000S35

high thermal conductivity plus “s-class” softness andconformability

features and benefits

• high-thermal conductivity: 5.0 w/m-k     

• highly conformable, “s-class” softness

• naturally-inherent tackreduces

interfacial thermal resistance

• conforms to demanding contoursand

maintains structural integrity withlittle

or no stress applied to fragile

component leads

• fiberglass reinforced forpuncture,

shear and tear resistance

• excellent thermal performanceat

low pressures

bergquist  gap pad  tgp 5000 is afiberglass-reinforced filler and polymer featuring a high thermalconductivity. the material yields extremely softcharacteristics  while maintaining elasticity andconformability. the fiberglass reinforcement provides easy handlingand converting, added electrical isolation and tear resistance. theinherent natural tack on both sides assists in application andallows the product to effectively fill air gaps,enhancing theoverall thermal performance.the top side has reduced tack for easeof handling. bergquist  gp5000s35 is ideal forhigh-performance  applications at low mounting pressures.

bergquist gap pad 5000s35  typical applicationsinclude:

• voltage regulator modules (vrms) and pols

• cd-roms and dvd-roms

• pc board to chassis

• asics and dsps

• memory packages and modules

• thermally-enhanced bgas

configurations available:

• die-cut parts are available in any shape or size, separated orin sheet form