Gap Pad 2500无基材的导热填充材料

品牌贝格斯型号gp2500耐温-60到+200（℃）颜色light brown厚度0.5mm到3.17（mm）宽度203（mm）长度406（mm）产品认证sgs msds适用范围处理器和散热器之间

特点和好处

gap pad2500是无基材增强的导热绝缘间隙填充材料，非常的柔软和具有弹性，易加工和转化而非增强的。gap pad2500为高低不平的表面，气隙和粗糙的表面提供有效的传热界面。所有的这些性能使材料能够理想的用在中等压力下的螺丝固定安装中。gappad2500在装配的过程中两边用螺丝钉自然的固定从而固定其位置。材料的两边都有保护衬垫保护。

典型应用

多个发热元器件与普通散热器之间、图形芯片和散热器之间、处理器和散热器之间、大容量存储器、有线/无线通讯硬件

typical properties ofgap pad 2500

propertyimperial＆#118aluemetric＆#118aluetestmethodcolorlightbrown lightbrownvisualreinforcementcarrier ─ ─ ─thickness(inch)/(mm)0.020to 0.1250.508 to3.175 astm d374inherentsurface tack(1or 2 sided) 22─density(g/cc)3.13.1astmd792heatcapacity(l/g-k) 1.0 1.0 astm c351hardness,bulkrubber(shore00)(1)8080 astm d2240young"smodulus(psi)/(kpa)(2)113779astm d575continuous use temp(ºf)/(℃) -76 to 392 -60to200─electricaldielectricbreakdown voltage(vac)＞6000 ＞6000 astm d149dielectricconstant(1000hz)6.8 6.8 astm d150

volume resistivity(ohm-meter)1011 1011astmd257

flame rating v-ov-o u.lthermalthermalconductiviy(w/m-k) 2.72.7 astmd5470

1)one second delay ＆#118alue shore00 hardness scale.

2)young"s modulus,calculated using0.01 in/min.step rate of strain with a sample size of 0.79inch2.for more information on gap pad modulus.referuist application note #116.

可供规格

片材、模切

厚度：0.020",0.040",0.060",0.080",0.100",0.125"