供应广和通LTE模块L860-GL

基本特性

dimension(mm):42.00 x30.00 x 2.30

package:m.2

ltefdd:b1/b2/b3/b4/b5/b7/b8/b12/

b13/b14/b17/b18/b19/b20/b21/b25/

b26/b28/b29/b30/b32/b66

ltetdd:b38/b39/b40/b41/b42

wcdma:b1/b2/b4/b5/b8

powersupply:3.135v~4.4v(typical3.3v)

operatingtemp.:-10℃~+55℃

接口

sim:x 2,1.8v/3.0v

pcie:■

gpio:■

认证

regulation:rohs/hf/fcc/ce-red/cb/gcf/ptcrb

ita:ccc/srrc/icta/iftel/anrceti(smcoc)/anrt/incm/nta/btp/rcm/ncc/tra/pta/conatel/mtc/ntc/fcc/ictqatar/fac/fss/citc/artp/ratel/imda/icasa/msip/trcsl/sccom/tcra/nbtc/tatt/cert/uadoc&nkrzi regidtration/ncc/ozs coc/ mic/part ofmorocco/potraz

operator:verizon/at&t/sprint/dt/telefonica/vodafone/swisscom/docomo/kddi/softbank/telstra/optus

传输速率

lte fdd(mbps):1gbps(dl)/75(ul);  cat 16

lte tdd(mbps):1gbps(dl)/75(ul); cat 16

umts(kbps):384(dl)/384(ul)

dc-hspa+(mbps):42(dl)/11.5(ul); cat 24/cat 7

功能

ussd:■

stk:■

osdriver:windows/linux**

gnss:■

sms:■

protocols:ncm/mbim