激光切割机、激光焊接机、激光切割机、激光焊接机、激光切割机、激光焊接机、激光切割机、激光焊接机、激光切割机、激光焊接机、激光切割机、激光焊接机、激光切割机hy-dp50半导体侧面泵浦激光打标机特点
在机器结构上进行了较大改进:光学系统采用全密封结构、具有光路预览和焦点指示功能、外表更美观、操作更方便；该机器配备新的外置水冷系统，运行噪音极低，温度调节精度高，为机器长时间运作提供了可靠的保障。该设备也用于配合生产流水线及自动化生产线的设备。
行业的应用
可标记金属及多种非金属。适合应用于一些要求更精细、精度更高、打深度的加工场合。广泛应用于电子元器件、集成电路(ic)、电工电器、手机通讯、五金制品、工具配件、精密器械、汽车配件、塑料按键、食品及药品包装、pvc管
、医疗器械等行业。
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