产品型号
eh9721
product model
eh9721
贴装精度
±2µm@3σ
placement accuracy
±2µm@3σ
贴装角度
±0.3°
placement angle
±0.3°
贴装工艺
共晶、蘸胶、flipchip(选配)
placement process
eutectic, underfill, flip chip (optional)
设备应用
coc,cob,goldbox,cow,cos
e application
coc,cob,gold box,cow,cos
效率
15~25s/pcs(共晶, 依据具体应用)
5~7s/pcs(蘸胶, 依据具体应用)
efficiency
15~25 seconds per piece (eutectic, depending on actualworking conditions)
5~7 seconds per piece (underfill, depending on actualworking conditions)
贴装模块
吸嘴
单头12个,动态换刀
nozzle
12 nozzles per single head, dynamic tool change
力控
(10g-50g)±2g;
(50g-300g)±3%
surface mount technology (smt) module
force control
(10g-50g)±2g;
(50g-300g)±3%
移栽模块
吸嘴
/
nozzle
力控
/
transfer module
force control
共晶模块
工作台
1
workbench
1
中转台
单工作台8个(多)
transfer station
8 (maximum) on a single workbench
加热方式
脉冲加热
heating method
pulse heating
温度范围
500°c(高)
temperature range
up to 500°c (maximum)
温升速率
50°c/s(大)
eutectic module
temperature ramp rate
up to 50°c/s (maximum)
供料模式
wafer,waffle pack,gel-pak
wafer,6吋,多支持2个
wafer, 6 inches, supports up to 2 pieces
waffle pack, gel-pak,2吋,多支持9个
waffle pack, gel-pak, 2 inches, supports up to9 pieces
轨道接驳上下料(选配)
feeding mode
wafer,waffle pack, gel-pak
track connection loading and unloading (optional)
外形尺寸(长×宽×高)
1650mm×1100mm×1800mm
overall dimension (length x width x height)
1650mm×1100mm×1800mm
重量
2200kg(大)
weight
2200kg (maximum)
压缩空气
0.4~0.7mpa
compressed air
0.4~0.7mpa
氮气
0.4~0.7mpa
nitrogen
0.4~0.7mpa
环境温度
23±2°c
ambient temperature
23±2°c