high power diode laser systemsdiolas |
(diolas dd50-2 withdiode module diomod–808-50-600-pi and heat sink hs120) |
diolas-systemsconsist of: |
the combined highpower laser driver and tec controller of a.l.s. – a highperformance driver for high power diode laser modules, optimizedfor the best performance in industrial applications and for the usein research and development laboratories. it delivers an outputcurrent up to 50 a and a voltage up to 3 or 6 v and is designed forcw and pulsed operation with a rise time of 100 µs. it alreadyincludes the thermo-electrical temperature controller for activetemperature stabilization and regulation of the used diode lasermodule. the air forced highpower laser diode heat sink of a.l.s., designed for heat loads upto 120, 80, 60 or 40 watt (depending from the needed heat load forthe used diode laser module). the heat sink includes the metalblock, a temperature sensor, the peltier cooling element (tec) anda fan for the heat dissipation. the diode lasermodule. for most of the pigtailed modules a visible (red) pilot(aiming) diode laser can be included in the diode lasermodule. |
featureslaser diode modules with output power up to 50 wfor the fiber coupled versionslaser diode modules with currents up to 50amicroprocessor controlledtemperature controlleddifferent cases and housingspossiblefiber coupled systems with low diameter and lowna (0.22) fibers (core diameter 100 µm, 200 µm, 400 µm, 600 µm, 800 µm,…) user-friendly and reliable systems |
applicationsmaterial processing and micro materialprocessing,stabilized pump sources for diode pumped solidstate lasers or fiber laserssources for illumination andlightningresearch and developmentoem versions for test systems for laser diodemodule parameters (lifetime, burn in) |
two different systems areavailable: 30 w cw/pulsed systems (prepared for fiber coupling 400µm, 600 µm, …) @ 808 nm @ 940 nm @ 980 nm 50 w cw/pulsed systems (prepared forfiber coupling 400 µm, 600 µm, …) @ 808 nm @ 940 nm @ 980 nm |
the high power laser diode system will beassembled and measured out corresponding to the special applicationof the customer. of course the customer can buy also the driver andthe needed laser diode heat sink and use his own diode laser moduleto assemble his own system. |