销售机械臂式超声波清洗机

类型机械臂式适用领域硅片用途工业用槽数6槽型号多种超声清洗频率20-40清洗温度55-75（℃）工作方式它激式外形尺寸根据工艺定制（cm）品牌铭仕功率定制

1、适用范围：硅片、电子精密零件等。
2、适用清洗剂：水剂
3、结构特点：
•各槽上下抛动，工件在抛动过程中使污垢彻底脱落。
•槽体正面设有控制面板，可根据清洗工艺设置。
•每个槽子底部设有接渣口，便以排渣且能及时沉淀污垢。
•使用全水基溶剂环保清洗工艺。

⑴超声清洗（加热）→⑵超声清洗（加热）→⑶超声清洗（加热）→
⑷超声清洗（加热）→⑸超声漂洗（加热）→⑹超声漂洗（加热）
4、技术参数：具体结构尺寸和规格请咨询本公司索要相应清洗工艺。

silicon ultrasonicdescription

a scope of application:silicon wafers, electronic precision parts and so on.

2, suitable cleaning agent:agent

3, structuralfeatures:

• the tank moving up anddown throwing the workpiece in the moving process, to throw dirtoff completely.

• tank e with frontcontrol panel can be set up under the cleaning process.

• each slot has accessresidue at the bottom of the mouth and can be timely in order toslag deposition dirt.

• make use ofenvironmentally friendly water-based solvent cleaningprocesses.

⑴ ultrasonic cleaning(heating) → ⑵ ultrasonic cleaning (heating) → ⑶ ultrasonic cleaning(heating) →

⑷ ultrasonic cleaning(heating) → ⑸ ultrasonic rinsing (heating) → ⑹ ultrasonic rinsing(heating)

4, technical parameters:specific structural dimensions and specifications please contactthe company ask for the appropriate cleaningue.